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STRUCTURE PRODUCT SERIES
Silicon Monolithic Integrated Circuit Low ESR capacitor, 1A Low Dropout Voltage Regulator with Shut Down SwitchAdjustable Voltage
TYPE
FEATURES
Output Current : 1A High Output Voltage Precision: 1 High Input Voltage : 35V
ABSOLUTE MAXIMUM RATINGSTa=25
Parameter Symbol Supply Voltage 1 Vcc Output Control Voltage VCTL Power Dissipation 2 Pd Operating Temperature Range Topr Storage Temperature Range Tstg Maximum Junction Temperature Tjmax 1 Not to exceed Pd. 2 Reduced by 14.8mW / C over Ta = 25C without heatsink. Limits -0.3+35.0 -0.3+35.0 1.85 -40+105 -55+150 150 Unit V V W
OPERATING CONDITIONSTa=25
Parameter Supply Voltage Output Control Voltage Output Current Output Voltage Symbol Vcc VCTL Io Vo Min. 4.0 0 0 3.0 Max. 25.0 25.0 1.0 15.0 Unit A V
NOTE : This product is not designed for normal operation within a radio active environment.
REV.
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ELECTRICAL CHARACTERISTIC Unless otherwise specified, Ta=25,Vcc=10V,VCTL=5V,Io=0mA,Vo=5.0Vsetting The resistor of between ADJ and Vo =56.7k,ADJ and GND =10k
Parameter Shut Down Current Bias Current ADJ Terminal Voltage Dropout Voltage Ripple Rejection Line Regulation Load Regulation Temperature Coefficient of Output Voltage CTL ON Mode Voltage CTL OFF Mode Voltage CTL Bias Current 1 ein : Input Voltage Ripple Symbol Isd Ib VADJ Vd R.R. Reg.I Reg.L Tcvo.1 Tcvo.2 VthH VthL ICTL Limit Min. 0.742 45 2.0 Typ. 0 0.5 0.750 0.3 55 20 Vox0.010 +0.04 0.005 25 Max. 10 1.0 0.758 0.5 60 Vox0.015 0.8 50 Unit A mA V V dB mV V / / V V A Io=50mA Vcc=Vox0.95, Io=500mA f=120Hz,ein =1Vrms, Io=100mA Vcc=625V Io=5mA1A Io=5mA,Tj=-40-20 Io=5mA,Tj=-20+105 ACTIVE MODE OFF MODE
1
Conditions VCTL=0V
PHYSICAL DIMENSIONS, MARKING
D00C0WCP5
Lot No.
T0220CP-V5 (UNIT:mm)
REV. A
3/4 BLOCK DIAGRAM Pin Number , Pin Name
Pin Number 1 2
OCP TSD
VREF
Driver
VREF Bandgap Reference OCP Over Current Protection circuit TSDThermal Shut Down circuit Driver Power Transistor Driver
Pin Name CTL Vcc GND Vo ADJ
Function Output Control Pin Power Supply Pin GND Pin Output Pin Adjustable Pin
3 4 5
1
2
3
4
5
CTL
Vcc
GND
Vo
ADJ
Operation Notes
1. Absolute maximum ratings Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result in damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open mode) when such damage is suffered. If operational values are expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC. 2. Electrical characteristics described in these specifications may vary, depending on temperature, supply voltage, external circuits and other conditions. Therefore, be sure to check all relevant factors, including transient characteristics. 3.GND potential The potential of the GND pin must be the minimum potential in the system in all operating conditions. Ensure that no pins are at a voltage below the GND at any time, regardless of transient characteristics. 4.Ground wiring pattern When using both small-signal and large-current GND traces, the two ground traces should be routed separately but connected to a single ground potential within the application in order to avoid variations in the small-signal ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance. 5.Inter-pin shorts and mounting errors Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in damage to the IC. Shorts between output pins or between output pins and the power supply or GND pins (caused by poor soldering or foreign objects) may result in damage to the IC. 6.Operation in strong electromagnetic fields Using this product in strong electromagnetic fields may cause IC malfunction. Caution should be exercised in applications where strong electromagnetic fields may be present. 7.Testing on application boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC's power supply should always be turned off completely before connecting or removing it from a jig or fixture during the evaluation process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8.Thermal consideration Use a thermal design that allows for a sufficient margin in light of the Pd in actual operating conditions. Consider Pc that does not exceed Pd in actual operating conditions. PdPc Tjmax : Maximum junction temperature=150, Ta : Peripheral temperature[] , ja : Thermal resistance of package-ambience[/W], Pd : Package Power dissipation [W], Pc : Power dissipation [W], Vcc : Input Voltage, Vo : Output Voltage, Io : Load, Ib : Bias Current Package Power dissipation : Pd (W)(TjmaxTa)ja Power dissipation : Pc (W)(VccVo)xIoVccxIb 9.Vcc pin I nsert a capacitorVo5V:capacitor1F, Vo5V:capacitor2.2F between the Vcc and GND pins. capacitance value varies by application. Be sure to allow a sufficient margin for input voltage levels.
The appropriate
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10.Output pins It is necessary to place capacitors between each output pin and GND to prevent oscillation on the output. Usable capacitance values range from 1F to 1000F. Ceramic capacitors can be used as long as their ESR value is low enough to prevent oscillation (0.001 to 20). Abrupt fluctuations in input voltage and load conditions may affect the output voltage. Output capacitance values should be determined only through sufficient testing of the actual application. 11.Over current protection circuit (OCP) The IC incorporates an integrated over-current protection circuit that operates in accordance with the rated output capacity. This circuit serves to protect the IC from damage when the load becomes shorted. It is also designed to limit output current (without latching) in the event of a large and instantaneous current flow from a large capacitor or other component. These protection circuits are effective in preventing damage due to sudden and unexpected accidents. However, the IC should not be used in applications characterized by the continuous or transitive operation of the protection circuits. 12.Thermal shutdown circuit (TSD) The IC incorporates a built-in thermal shutdown circuit, which is designed to turn the IC off completely in the event of thermal overload. It is not designed to protect the IC from damage or guarantee its operation. ICs should not be used after this function has activated, or in applications where the operation of this circuit is assumed. 13.Applications or inspection processes where the potential of the Vcc pin or other pins may be reversed from their normal state may cause damage to the IC's internal circuitry or elements. Use an output pin capacitance of 1000F or lower in case Vcc is shorted with the GND pin while the external capacitor is charged. Insert a diode in series with Vcc to prevent reverse current flow, or insert bypass diodes between Vcc and each pin. 14.Positive voltage surges on VCC pin A power zener diode should be inserted between VCC and GND for protection against voltage surges of more than 35V on the VCC pin. 15.Negative voltage surges on VCC pin A schottky barrier diode should be inserted between VCC and GND for protection against voltages lower than GND on the VCC pin. 16. Output protection diode Loads with large inductance components may cause reverse current flow during startup or shutdown. diode should be inserted on the output to protect the IC.
In such cases, a protection
17.Regarding input pins of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. PN junctions are formed at the intersection of these P layers with the N layers of other elements, creating parasitic diodes and/or transistors. For example (refer to the figure below): When GND > Pin A and GND > Pin B, the PN junction operates as a parasitic diode When GND > Pin B, the PN junction operates as a parasitic transistor Parasitic diodes occur inevitably in the structure of the IC, and the operation of these parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Accordingly, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided.
Resistor (Pin A) (Pin B)
Transistor (NPN) B E C
(Pin B) B C E GND N Parasitic elements or transistors
N P+ N P N P P+ N Parasitic elements GND N P+ N
P
P+
P substrate (Pin A) Parasitic elements or transistors GND Parasitic elements
Example of Simple Monolithic IC Architecture
REV. A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
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R1010A

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